◎ Greater Diversity of Chamber Configuration

     √ Single Decker （SS Type）

     √ 4 Chambers

     √ 8 Chambers

◎ Smaller footprint

◎ Double Decker (SSD Type)

     √ 8 Chambers

     √ 12 Chambers​ 

◎ フットプリントの低減（10％）
◎ 1薬液+1DIW構成に対応
◎ 配管のシンプル化の実現
◎ ウエハの接触部の縮小化の実現
◎ 気泡発生の低減化を実現
◎ リバースフローシステムにより液置換効率を向上
◎ 濃度の安定性を向上
◎ 豊富なバスの種類に対応

◎ Increased throughput

◎ Selection of high speed LD/ULD (I-Type) (up to 500 WPH with 300mm wafers)

◎ Smaller footprint

◎ Reduced CoO

◎ Air flow control

◎ Complete standardization (stabilized performance, reduced set-up time)

◎ SEMI standard

◎ SECS/GEM compliant

◎ EES (EDA or TDI) compliant​ 

◎ High throughput

◎ Process time throughput

◎ Front side 450 WPH

◎ Both sides 225 WPH

◎ Small footprint

◎ Double decker system

◎ Wafer cleaning method

◎ Brush type

◎ SN spray

◎ Local cleaning with original chemical jet nozzle

◎ No Purge N2

◎ Damage-free

◎ No cover DIW

◎ Watermark-free​ 

◎ Two Types of IPA Mist Generation Systems

     1. Injection System 

          IPA concentration control

          Independent adjustable IPA flow rate and N2 flow rate

     2. Budding System 

          Selectable N2 gas temperature (hot and cool)

          Switchable high and low consentration

◎ Two Types of IPA Mist Jet Systems

     1. Indirect Jet System 

          Uniformed IPA consentration in the drying chamber

          Decreased drying tyme by 250-300 seconds (including transfer time)

     2. Direct Jet System 

          IPA mist jet system from the upper part in the chamber

          Switchable high and low consentration

◎ Continuous process in oxygen-free conditions 

◎ RD mode (DIW) rinse-dry

◎ FRD mode DHF- (DIW) rinse-dry

◎ Uniformity: oxide etch uniformity

◎ 30ű4% (FMMDS mode only)

◎ 45nm compatibility​ 

◎ Meets the process needs of the semiconductor industry, and many other industries.

◎ The module units are combined, allowing for quick delivery and performance unity.

◎ There is an abundance of options which will allow the user to obtain the desired functions.

◎ The module size can be adjusted from its regular dimensions.

◎ Easy to operate.​ 

◎ Clean unit installed.

◎ The droplet measuring is accurate (±10%).

◎ The droplet collection is efficient (over 90%).

◎ The maximum amount of the droplet is 200μl (depending on the liquid composition).

◎ The collecting performance level is 10atons/cm2 (for 8-inch wafers), from AAS analysis (depending on the liquid composition).

◎ Scanning is available for any intended range by changing the mode setting.

◎ A retainer will be used for each wafer, to prevent cross-contamination.

◎ Contains CE mark.​ 

◎ Custom Made, Low Cost 

◎ Custom Made, Low Cost ​

◎ Custom Made, Low Cost

      √ Automated Spin Dryer

      √ Spin Dryer

◎ Custom Made, Low Cost