JET Co., Ltd.

FEATURES

• 2 type of IPA mist generation system
• 1.Injection system
  IPA concentration control
  Adjustable IPA flow rate and N2 flow rate independently
• 2.Budding system
  Selectable N2 gas temperature (Hot and Cool)
  Switchable High and Low concentration
• 2 type of IPA Mist Jet System
• 1.Indirect Jet System
  Uniformed IPA concentration in the drying chamber
  Decreased drying time by 250-300 sec. (including transfer time)
• 2.Direct Jet System
  IPA Mist Jet System from the upper part in the chamber
  Switchable High and Low concentration

• Continuous process in an oxygen-free condition
  RD mode（DIW） rinse-dry
  FRD mode DHF- （DIW） rinse-dry
• Uniformity: Oxide Etch Uniformity
• 30ű4%(FMMDS mode only)
• Compatible 45nm

FEATURES

• Use of room temperature IPA mist
  Low IPA usage

• Flexible construction to consider replacing the existing JET tool
• Thin wafer compatible
• Patent pending